Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects
2014
2017-01-13 14:21:55
1033
Resists, Fabrication, Electrical resistance measurement, Substrates, Dispersion, Resistance, Surface treatment
r6
Xu
Pingye
70
Fei
Tong
70
Virginia
Davis
70
Minseo
Park
70
Michael
Hamilton
70
COBISS_ID
3
4636923
DOI
15
10.1109/TNANO.2014.2340132
NUK URN
18
URN:SI:UNG:REP:Y7K5XX3W
TNANO2340132.pdf
4733225
Predstavitvena datoteka
2017-01-13 14:22:11