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1. Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects Xu Pingye, Fei Tong, Virginia Davis, Minseo Park, Michael Hamilton, 2014, original scientific article Keywords: Resists, Fabrication, Electrical resistance measurement, Substrates, Dispersion, Resistance, Surface treatment Published in RUNG: 16.01.2017; Views: 4970; Downloads: 0 This document has many files! More...

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