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Naslov:Atomic layer deposition for the photoelectrochemical applications
Avtorji:Pastukhova, Nadiia (Avtor)
Mavrič, Andraž (Avtor)
Li, Yanbo (Avtor)
Datoteke:URL https://onlinelibrary.wiley.com/doi/10.1002/admi.202002100
 
Jezik:Angleški jezik
Vrsta gradiva:Neznano ()
Tipologija:1.02 - Pregledni znanstveni članek
Organizacija:UNG - Univerza v Novi Gorici
Opis:Substantial progress has been made in the photoelectrochemical (PEC) field to understand the photoelectrode behavior, semiconductor‐electrolyte interface, and photocorrosion, enabling new photoelectrode architectures with higher photocurrent, reduced photovoltage losses, and longer lifetime. Nevertheless, for practical PEC applications additional efforts are still needed to optimize all components of the photoelectrodes, including the light absorbing semiconductors, the layers for charge extraction, charge transfer, corrosion protection, and catalysis. In this regard, atomic layer deposition (ALD) offers new opportunities due to the monolayer‐by‐monolayer deposition approach, allowing preparation of conformal films with precisely controlled thickness and composition. As the ALD instruments are becoming widely accessible, this review aims to make an overview of the applications for photoelectrodes fabrication. The deposition of semiconductors onto flat and nano‐textured substrates, the deposition of ultrathin interlayers to ease charge transport by energy band alignment and surface states passivation, the deposition of corrosion protection layers, and finally, the possibilities for high catalyst dispersion is presented.
Ključne besede:atomic layer deposition, charge recombination, charge transfer, photocorrosion, photoelectrochemical water splitting
Leto izida:2021
Št. strani:str. 1-22
Številčenje:iss. , Vol.
COBISS_ID:53115651 Povezava se odpre v novem oknu
UDK:620.1/.2
ISSN pri članku:2196-7350
URN:URN:SI:UNG:REP:5WBO9XDN
DOI:10.1002/admi.202002100 Povezava se odpre v novem oknu
Število ogledov:343
Število prenosov:11
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Gradivo je del revije

Naslov:Advanced materials interfaces
Založnik:Wiley-VCH
ISSN:2196-7350
COBISS.SI-ID:522945561 Novo okno

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