| Title: | Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects |
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| Authors: | ID Pingye, Xu (Author)
ID Tong, Fei (Author)
ID Davis, Virginia (Author)
ID Park, Minseo (Author)
ID Hamilton, Michael (Author) |
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| Files: |
This document has no files that are freely available to the public. This document may have a physical copy in the library of the organization, check the status via COBISS.  |
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| Language: | English |
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| Work type: | Not categorized |
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| Typology: | 1.01 - Original Scientific Article |
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| Organization: | UNG - University of Nova Gorica
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| Keywords: | Resists, Fabrication, Electrical resistance measurement, Substrates, Dispersion, Resistance, Surface treatment |
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| Year of publishing: | 2014 |
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| Number of pages: | 9 |
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| Numbering: | 6, 13 |
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| PID: | 20.500.12556/RUNG-2897-486ff596-9d63-be31-b9d4-3e3ba68acb00 |
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| COBISS.SI-ID: | 4636923 |
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| DOI: | 10.1109/TNANO.2014.2340132 |
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| NUK URN: | URN:SI:UNG:REP:Y7K5XX3W |
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| Publication date in RUNG: | 16.01.2017 |
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| Views: | 4090 |
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| Downloads: | 0 |
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