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Title:Atomic layer deposition for the photoelectrochemical applications
Authors:ID Pastukhova, Nadiia (Author)
ID Mavrič, Andraž (Author)
ID Li, Yanbo (Author)
Files:URL https://onlinelibrary.wiley.com/doi/10.1002/admi.202002100
 
Language:English
Work type:Unknown
Typology:1.02 - Review Article
Organization:UNG - University of Nova Gorica
Abstract:Substantial progress has been made in the photoelectrochemical (PEC) field to understand the photoelectrode behavior, semiconductor‐electrolyte interface, and photocorrosion, enabling new photoelectrode architectures with higher photocurrent, reduced photovoltage losses, and longer lifetime. Nevertheless, for practical PEC applications additional efforts are still needed to optimize all components of the photoelectrodes, including the light absorbing semiconductors, the layers for charge extraction, charge transfer, corrosion protection, and catalysis. In this regard, atomic layer deposition (ALD) offers new opportunities due to the monolayer‐by‐monolayer deposition approach, allowing preparation of conformal films with precisely controlled thickness and composition. As the ALD instruments are becoming widely accessible, this review aims to make an overview of the applications for photoelectrodes fabrication. The deposition of semiconductors onto flat and nano‐textured substrates, the deposition of ultrathin interlayers to ease charge transport by energy band alignment and surface states passivation, the deposition of corrosion protection layers, and finally, the possibilities for high catalyst dispersion is presented.
Keywords:atomic layer deposition, charge recombination, charge transfer, photocorrosion, photoelectrochemical water splitting
Year of publishing:2021
Number of pages:str. 1-22
Numbering:Vol. , iss.
PID:20.500.12556/RUNG-6307 New window
COBISS.SI-ID:53115651 New window
UDC:620.1/.2
ISSN on article:2196-7350
DOI:10.1002/admi.202002100 New window
NUK URN:URN:SI:UNG:REP:5WBO9XDN
Publication date in RUNG:25.02.2021
Views:2446
Downloads:139
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Record is a part of a journal

Title:Advanced materials interfaces
Publisher:Wiley-VCH
ISSN:2196-7350
COBISS.SI-ID:522945561 New window

Document is financed by a project

Funder:ARRS - Slovenian Research Agency
Project number:P1-0055, P2-0412, J2-2498

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