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Title:Nastavljanje referenčnega temperaturnega profila pretočne peči
Authors:ID Rijavec, Mitja (Author)
ID Kocijan, Juš (Mentor) More about this mentor... New window
Files:URL http://www.ung.si/~library/diplome/PTF/22Rijavec.pdf
 
.pdf 22Rijavec.pdf (684,11 KB)
MD5: 9E3F533137DB89AAD58B94008EBA5346
 
Language:Slovenian
Work type:Undergraduate thesis
Typology:2.11 - Undergraduate Thesis
Organization:PTF - Faculty of Engineering and Management
Abstract:V diplomski nalogi je predstavljena nastavitev referenčnega temperaturnega profila pretočne peči za strjevanje lepljenih elektronskih vezij na iterativenali eksperimentalni način ter na podlagi računalniške simulacije. V uvodnem delu je predstavljen opis idealnega referenčnega temperaturnega profila ter problematika starega lepila in hkrati uporaba novega lepila za lepljenje elektronskih vezij, ki je tudi vzrok za izdelavo novega temperaturnega profila. Temu sledi prikaz izdelave referenčnega temperaturnegaprofila na eksperimentalen ročni način. Za računalniško podprto načrtovanje profila pa je bilo potrebno izdelati najprej matematični model spreminjanja temperature v pretočni peči in ga nato na podlagi tega modela simulirati z orodjem za simulacijo. Na koncu sledi še izdelava referenčnega temperaturnega profila s simulacijo. Rezultat simulacije prikazuje referenčni temperaturni profil in potrebne temperaturne nastavitve na pretočni peči. Končni rezultat diplomske naloge je poleg primerjave obeh pristopov k izdelavireferenčnega temperaturnega profila tudi računalniška simulacija delovanja pretočne peči, v kateri lahko poljubno simuliramo spremembe temperaturnega profila v zelo kratkem času. Primerjava obeh pristopov je pokazala, da je pristop s simulacijo bistveno bolj hitrejši in primeren za uporabo.
Keywords:diplomske naloge, referenčni temperaturni profil, pretočne peči, matematično modeliranje, računalniška simulacija, Scicos
Place of publishing:Nova Gorica
Publisher:M. Rijavec
Year of publishing:2006
Number of pages:XI, 64 str.
PID:20.500.12556/RUNG-82 New window
COBISS.SI-ID:479227 New window
UDC:681.5
NUK URN:URN:SI:UNG:REP:ISTQ99AN
Publication date in RUNG:15.10.2013
Views:6936
Downloads:389
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Secondary language

Language:English
Abstract:This diploma thesis deals with the setting of a reference temperature profile for a Reflow oven, which is used for drying the sticked electronic circuits initerative or experimental way and by using computer simulation. The introduction describes the ideal referenced temperature profile, the difficulties of the old glue and at the same time the use of the new glue for sticking the electronic circuits, which is also the reason for making the new temperature profile. Then, a presentation of the reference temperature profilemaking in experimental manual way follows. For computer profile planning it was necessary first to make a mathematical model of temperature heating in the Reflow oven and then, based on this model to simulate it by simulating tools. In the end, the making of the reference temperature profile and simulation follow. The simulation result shows the reference temperature profile and the required temperature settings on the Reflow oven. The final result of this thesis is, in addition to comparison of both approaches to design the referenced temperature profile, also a computer simulation of the Reflow oven operation that enables simulations of temperature profile changes in a very short period of time. The comparison of the two approaches proves the simulation approach to be substantially faster and more appropriate to use.


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